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Study Group: Semiconductor Experts in GLG Member Programs (outside North America)

Council Members in this Study Group: 179

This study group may include experts knowledgeable on topics such as IT Services, consumer electronics, wireless devices, software, hardware, information technology, semiconductors, media, cable, satellite, internet, broadband, global positioning systems, advertising, online media, telecommunications, networking, wireless, and data storage, among others.

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Leading Experts in this Study Group

Hussein Fawaz

SVP & GM EMEA
AMKOR TECHNOLOGY, INC. - CC
What is a GLG Leader?|GLG Leaders are a separate tier of Council Members with a Council Rank in the top 5%. These GLG Member Program participants are eligible for ongoing, in-depth consultative relationships with GLG clients.

Hussein Fawaz is currently SVP & General Manager of EMEA at Amkor Technology the second largest assembly and test semiconductor subcontractor provider. Amkor customers include all semiconductor companies (IDM and Fabless) as well many electronics OEM...

Verjesh Aggarwala

President and Chief Executive Officer
Supreme Components International Pte. Ltd.
What is a GLG Leader?|GLG Leaders are a separate tier of Council Members with a Council Rank in the top 5%. These GLG Member Program participants are eligible for ongoing, in-depth consultative relationships with GLG clients.

Verjesh Aggarwala is the President and Chief Executive Officer at Supreme Components International, a Singapore based firm distributing semiconductors and components. Prior, Mr. Aggarwala was the President at Nu Horizons; a leading global distributor...

Chuen-Yi Wang, Former Vice President, TAIWAN SEMICONDUCTOR CO., LTD.Chuen-Yi Wang

Former Vice President
TAIWAN SEMICONDUCTOR CO., LTD.
What is a GLG Leader?|GLG Leaders are a separate tier of Council Members with a Council Rank in the top 5%. These GLG Member Program participants are eligible for ongoing, in-depth consultative relationships with GLG clients.

Steven Wang was a Vice President at Taiwan Semiconductor Company, manufacturing broad line semiconductor components. He is responsible for managing, RFID printer+application-specific solutions, Kiosk/POS terminal, laptop, notebook, scanner, LCD projector,...

Nigel Dixon, Chief Executive Officer, Wireless IntelligenceNigel Dixon

Chief Executive Officer
Wireless Intelligence
What is a GLG Leader?|GLG Leaders are a separate tier of Council Members with a Council Rank in the top 5%. These GLG Member Program participants are eligible for ongoing, in-depth consultative relationships with GLG clients.

Nigel Dixon is the Chief Executive Officer of Wireless Intelligence, a management consultancy providing services to a range of companies in the wireless and consumer space. Mr. Dixon is an authority on the wireless and consumer electronics industry market...

Luciano Mule'Stagno, Associate Professor, University of MaltaLuciano Mule'Stagno

Associate Professor
University of Malta
What is a GLG Leader?|GLG Leaders are a separate tier of Council Members with a Council Rank in the top 5%. These GLG Member Program participants are eligible for ongoing, in-depth consultative relationships with GLG clients.

Luciano Mule'Stagno, PhD, is an Associate Professor at the University of Malta Institute for Energy Technology. In this new position, he would be devoting his full attention to monitor existing and promising new technologies and how they might be applied...

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GLG NewsSM Analyses by this Study Group's Leading Experts(?)

Opinions and analyses expressed in GLG News are solely those of the author. See the Terms of Use for details.

Consolidation Continues…

October 7, 2009

NXP merges STB business with Trident | www.telecompaper.com

The huge cost of developing TV ICs means that there aren't enough opportunities to go round.  Micronas concluded that the reward didn't justify the risk, and NXP is in the sameposition, hastened by its debt burden.  NXP is effectively contracting the restructure to Trident, which is shouldering the risk of restructuring and consolidation to end up as one of the last men standing.

M&A, JV in HDD Industry and SSD, Embedded System Replacement in 2011

February 19, 2009

Toshiba-Fujitsu Gives Storage Rivals an In | www.thestreet.com

HDD quantity of delivery under NB and the consumption electronic products demand leads, maintains 10~15% year growth rate, the hard disk quantity of delivery growth rate reaches as high as 18.9% in 2007, however because, on the other hand actually also the price competition day by day intensifies, causes the income earning to worsen, causes the hard disk market also to blow the purchase wind, even touches the related components factory. Stops to 2008, after eliminated and the conformity many times, the global hard disk entrepreneur from 41 in 1990, reduced to Seagate, WD, Hitachi Global Storage Technologies; HGST, Samsung, Toshiba and Fujitsu, Total 6. Seagate purchases and takes over Maxor after May, 2006, reaches as high as 35% of the global hard disk market in 2007. Fujitsu is the lowliest place in the hard disk market, because of hard disk enterprise deficit again and again, so that Toshiba is the most powerful customer to take over the Fujitsu hard disk enterprise.

More Rating Cut

February 18, 2009

Hynix Falls Most in Two Months on JPMorgan Rating Cut | www.bloomberg.com

Hynix will not have the reduction of capital plan. Hynix pass on the year's end to sell Oregon the Eugene factory to attain 306,000,000 US dollars in accordance to the turnover. Hynix, the beautiful light offers NAND the Flash technology Taiwan factory not to appreciate kindness rendered solves the DRAM difficult position most first. Hynix’s Creditor bank plans before the end of September to release the stockholder's rights value to estimate 880,000,000 US dollars again. Hynix reduces the workshop promotion disbursement and postpones the mainland joint capital factory investment. Hynix pelts capital outlay the global DRAM supply rate to grow only this year 20~30%, The 4th quarter, 2008 loses money 964,000,000 US dollars analysts anticipated in 2009 transport business difficult to show improvement after illness.   Obviously, JPMorgan will continuously the rating cut again. 

Pricing level based on supply and demand not consolidation

February 11, 2009

Winbond open to DRAM consolidation, says company executive | www.digitimes.com

As 30 X 12" memory fab were built in year 2007 and 14 of 30 were built in Taiwan for which the over supply statement happened with Zero Vista effect. Taiwan government trying to upgrade the advanced/ mainstream processing technology up to 48nm for DRAM and 30nm for NAND for cost down with high yield rate; integrate R&D power between Elpida, Micron and PSC, Inotera, Nanya, ProMos and Windbond. The technology alliance bundled with US$ 3B capitals. Above project is pending for an attractive business proposal. Qimonda went bankruptcy only provide around 10% of market demand which only created 20% price increases; 25% price gap to reach the breakeven price point. The global economic downturn made it worse as a serious storm in the 2nd layer although memory industry needs an M&A/ JV and cost down with advanced technology development as the industry dynamics.  As to the supply and demand relationship, expected to reach the balancing point in 2010 with basic Capex.   

3D Display Market Grows From 4.98M Units in 2007 to 8.12M Units in 2010

August 31, 2007

3-D printing for the masses | money.cnn.com

1. 3D Imaging & display technology international conference 2007 2. 3D interaction & display alliance congress, 3DIDA 3. 3D industry, Present and future

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Members in this Study Group include these company types:

  • Individual/Small Consultancy
  • Market Research Company*
  • Distributor
  • Discrete Components Manufacturer

Members in this Study Group often have these job titles:

  • Chief Executive Officer
  • Consultant
  • President
  • Director
  • Owner
  • Professor