IBM Develops Chip-Stacking Technique

The use of stacked die in a single chip will drive an increase in demand for known good die, which in turn will increase the focus on test at the probe stage.  This will change the accepted strategy in non-memory devices of a crude test to prevent packaging bad die into one of performance test at probe, as there will no longer be package test as a backstop.

1. The cost to power computers will soon exceed the cost to buy computers.2. The "new Moore's law" is to cut power consumption by half every 18 months for the same compute power.