Managing Director, ISB Ventures
Member of the Technology Council
Israel Beinglass, Ph.D, is President of ISB Ventures. He was until 2006, with Applied Materials, where he held various executive level positions. Currently, he is an Independent Consultant to the industry. Dr. Beinglass has over 25 years of experience in semiconductor technology, semiconductor manufacturing, and semiconductor equipment manufacturing. He has extensive experience in device fabrications, materials, yield, EDA, and device physics. Dr. Beinglass is an expert in thin films deposition, lithography, etches, RTP, Ion Implant, CMP, metrology, inspection and overall industry road map. He also specializes in well emerging nanotechnologies including LED and Solar both Crystalline Silicon and Thin Films. He was involved in several M&A activities, including due diligence and negotiations. Dr. Beinglass holds 30 US patents and is widely published in his field. Dr. Beinglass is an angel investor and currently involved with several start ups as an active board member. (This is me - Update Profile)
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New approach to scaling; no limit - yet.
June 25, 2009
Samsung's Kim Claims No Limit to Scaling | www.semiconductor.net
With all the gloom and doom facing the semiconductor industry and especially the “end of Moore’s law” coming up soon as many experts predicting it is a fresh and encouraging view that Samsung’s Kim presented. Kim, executive vice president and general manager of Samsung's Semiconductor R&D Center and Samsung Fellow claims that he believes that there are various possible paths to overcome obstacles of silicon scaling to continue to grow the silicon industry far beyond the nanometer range. It is definitely a brave new statement from a very respectable industry executive that goes against the most common notion that we are reaching the limit of scaling.
What is happening with Moore's law
March 2, 2009
Where chip industry is headed today | www.mercurynews.com
As Moore one of the fathers of the semiconductor industry turn 80 and the semiconductor industry on the biggest down turn in history, it is great opportunity to put things in perspective from one of the greatest entrepreneur of our time.
Does Samsung drive into the foundry world
December 8, 2008
Samsung foundry poaches Xilinx 40-nm business, says report | www.eetimes.com
Samsung entering into the foundry business could cause a major shift in the ranking of the three big foundries: TSMC. UMC and Chartered. Up to this point there were many rumors on some major fabless companies (TI, Qualcom) evaluating Samsung foundry capability. Samsung known to be very aggressive in their entry to new business, so it will be interesting. The implication could be enormous especially because of the relationship to the IBM alliances (including AMD and Chartered)
Does the collaboration between TEL and Novellus is a bad news for Applied Materials?
December 2, 2008
Tokyo Electron and Novellus Systems Announce Breakthrough Results and Collaboration on Copper Process Technology for 2Xnm and Beyond | www.semiconductor.net
The recent announcement from TEL and Novellus on developing new scheme for Copper interconnect is unprecedented for the following reasons 1.It is a rare scene to see two major Semi CapEX collaborating to develop advance future generation technology 2. TEL and Novellus technologies are complementing each other, so putting it together does make sense. 3.Watch out Applied Materials...this technology if successful will cut directly into Applied Materials PVD strong hold.
NEC the new addition to the IBM alliance
September 12, 2008
NEC to join IBM's 32nm development alliances | www.edn.com
With the skyrocketing cost for developing new processes more and more semiconductor companies are joining the IBM alliance the pre competitive process is getting less and less. NEC is just the last one from a parade of the companies that already joined the alliance. Looks like we are having only 2 classes of semiconductor technology in the world right now: a.Intel b.IBM alliance. The rest of the world semiconductor manufacturing is either part of it or copying from it. The most benefited company from that arrangement is IBM since all the payments received from the alliance members goes practically to the bottom line.
November 16, 2006 | New York
GLGi: Semiconductor Capital Equipment Trends